? semiconductor components industries, llc, 2012 july, 2012 ? rev. 11 1 publication order number: m1ma151wkt1/d m1ma151wkt1, m1ma152wkt1, SM1MA151WKT1G common cathode silicon dual switching diodes these common cathode silicon epitaxial planar dual diodes are designed for use in ultra high speed switching applications. these devices are housed in the sc ? 59 package which is designed for low power surface mount applications. features ? fast t rr , < 3.0 ns ? low c d , < 2.0 pf ? aec ? q101 qualified and ppap capable ? s prefix for automotive and other applications requiring unique site and control change requirements ? pb ? free packages are available* maximum ratings (t a = 25 c) rating symbol value unit reverse voltage m1ma151wkt1, SM1MA151WKT1G m1ma152wkt1 v r 40 80 vdc peak reverse voltage m1ma151wkt1, SM1MA151WKT1G m1ma152wkt1 v rm 40 80 vdc forward current single dual i f 100 150 madc peak forward current single dual i fm 225 340 madc peak forward surge current single dual i fsm (note 1) 500 750 madc thermal characteristics rating symbol max unit power dissipation p d 200 mw junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. t = 1 sec *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. http://onsemi.com sc ? 59 case 318d style 3 sc ? 59 package single silicon switching diodes 40 v/80 v 100 ma surface mount marking diagram mx m mx = device code x =t for 151 u for 152 m = date code* =pb ? free package 3 cathode 12 anode device package shipping ? ordering information m1ma151wkt1 sc ? 59 3,000/tape & reel m1ma151wkt1g sc ? 59 (pb ? free) 3,000/tape & reel m1ma152wkt1 sc ? 59 3,000/tape & reel m1ma152wkt1g 3,000/tape & reel sc ? 59 (pb ? free) ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. (note: microdot may be in either location) *date code orientation may vary depending upon manufacturing location. SM1MA151WKT1G sc ? 59 (pb ? free) 3,000/tape & reel
m1ma151wkt1, m1ma152wkt1, SM1MA151WKT1G http://onsemi.com 2 electrical characteristics (t a = 25 c) characteristic symbol condition min max unit reverse voltage leakage current m1ma151wkt1, SM1MA151WKT1G m1ma152wkt1 i r v r = 35 v v r = 75 v ? ? 0.1 0.1 adc forward voltage v f i f = 100 ma ? 1.2 vdc reverse breakdown voltage m1ma151wkt1, SM1MA151WKT1G m1ma152wkt1 v r i r = 100 a 40 80 ? ? vdc diode capacitance c d v r = 0, f = 1.0 mhz ? 2.0 pf reverse recovery time (figure 1) t rr (note 2) i f = 10 ma, v r = 6.0 v, r l = 100 , i rr = 0.1 i r ? 3.0 ns 2. t rr test circuit a r l t r t p t 10% 90% v r t p = 2 s t r = 0.35 ns i f t rr t i rr = 0.1 i r i f = 10 ma v r = 6 v r l = 100 recovery time equivalent test circuit input pulse output pulse figure 1. reverse recovery time equivalent test circuit
m1ma151wkt1, m1ma152wkt1, SM1MA151WKT1G http://onsemi.com 3 figure 2. forward voltage figure 3. reverse leakage v f , forward voltage (v) 100 v r , reverse voltage (v) 1 0.01 0.00001 10 0 10 0.1 20 30 40 50 60 70 0.0001 0.001 t a = ? 55 c 80 t a = 150 c t a = 25 c t a = ? 55 c i f , forward current (ma) 155 c 25 c figure 4. diode capacitance v r , reverse voltage (v) 6 5 4 3 2 1 0 0.5 0.52 0.54 0.56 0.58 0.6 0.62 0.64 c d , diode capacitance (pf) 8 7 1000 0.1 100 10 1 0.2 0 0.4 0.6 0.8 1 1.2 1.4 i r , reverse current ( a)
m1ma151wkt1, m1ma152wkt1, SM1MA151WKT1G http://onsemi.com 4 package dimensions sc 59 case 318d 04 issue h e a1 b a e d 2 3 1 c l notes: 1.?dimensioning and tolerancing per ansi y14.5m, 1982. 2.?controlling dimension: millimeter. 2.4 0.094 0.95 0.037 0.95 0.037 1.0 0.039 0.8 0.031 scale 10:1 *for additi onal information on our pb free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e dim a min nom max min millimeters 1.00 1.15 1.30 0.039 inches a1 0.01 0.06 0.10 0.001 b 0.35 0.43 0.50 0.014 c 0.09 0.14 0.18 0.003 d 2.70 2.90 3.10 0.106 e 1.30 1.50 1.70 0.051 e 1.70 1.90 2.10 0.067 l 0.20 0.40 0.60 0.008 2.50 2.80 3.00 0.099 0.045 0.051 0.002 0.004 0.017 0.020 0.005 0.007 0.114 0.122 0.059 0.067 0.075 0.083 0.016 0.024 0.110 0.118 nom max h e mm inches style 3: pin 1.?anode 2.?anode 3.?cathode on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 m1ma151wkt1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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